SMD Assembly<\/h1><\/div>Establishing a close relationship with our customers by offering them quality solutions and services.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
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<\/div><\/div>High-performance electronics manufacturing services<\/a><\/h2><\/div>Printed circuit assembly (PCBA)
\nOur state-of-the-art equipment and many years of expertise mean that we are one of the leading manufacturers of PCBAs.
\nOur activity also covers assembly, the manufacture of electronic sub-systems and even the packaged tested product ready for dispatch to the end customer.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
Advanced Electronics Expertise<\/a><\/h2><\/div>We can meet even the most complex demands in the electronics field, including the assembly of all types of components: BGA, FBGA, QFN, 0805, 0603, 0402, 0201…
\nThanks to Lean Manufacturing, continuous improvement and 5S, we offer the same level of quality to each of our customers.
\nBeing an electronics expert makes us an ideal partner for entering new markets.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>Advanced 3D SPI inspection<\/a><\/h2><\/div>We are convinced that 3D solder paste inspection (SPI) is a crucial technology in the electronics industry for precise solder control, detection of paste quality, offset, defects and data analysis to improve product quality, reliability and reduce production costs.
\nOur belief in the role led us to invest in a state-of-the-art 3D SPI machine from KohYoung.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
X-ray inspection for assemblies<\/a><\/h2><\/div>With the increasing complexity of electronic boards, X-ray inspection is now essential for checking the conformity of assembled boards. On boards with BGA or QFN components for the electronics industry, optical inspection is no longer sufficient for certain components. X-ray inspection therefore helps to eliminate the risk of producing defective boards and to optimise repair costs caused by \u2018cold\u2019 solder joints.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
Establishing a close relationship with our customers by offering them quality solutions and services.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
High-performance electronics manufacturing services<\/a><\/h2><\/div>Printed circuit assembly (PCBA)
\nOur state-of-the-art equipment and many years of expertise mean that we are one of the leading manufacturers of PCBAs.
\nOur activity also covers assembly, the manufacture of electronic sub-systems and even the packaged tested product ready for dispatch to the end customer.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
Advanced Electronics Expertise<\/a><\/h2><\/div>We can meet even the most complex demands in the electronics field, including the assembly of all types of components: BGA, FBGA, QFN, 0805, 0603, 0402, 0201…
\nThanks to Lean Manufacturing, continuous improvement and 5S, we offer the same level of quality to each of our customers.
\nBeing an electronics expert makes us an ideal partner for entering new markets.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>Advanced 3D SPI inspection<\/a><\/h2><\/div>We are convinced that 3D solder paste inspection (SPI) is a crucial technology in the electronics industry for precise solder control, detection of paste quality, offset, defects and data analysis to improve product quality, reliability and reduce production costs.
\nOur belief in the role led us to invest in a state-of-the-art 3D SPI machine from KohYoung.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
X-ray inspection for assemblies<\/a><\/h2><\/div>With the increasing complexity of electronic boards, X-ray inspection is now essential for checking the conformity of assembled boards. On boards with BGA or QFN components for the electronics industry, optical inspection is no longer sufficient for certain components. X-ray inspection therefore helps to eliminate the risk of producing defective boards and to optimise repair costs caused by \u2018cold\u2019 solder joints.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
Printed circuit assembly (PCBA)
\nOur state-of-the-art equipment and many years of expertise mean that we are one of the leading manufacturers of PCBAs.
\nOur activity also covers assembly, the manufacture of electronic sub-systems and even the packaged tested product ready for dispatch to the end customer.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
Advanced Electronics Expertise<\/a><\/h2><\/div>We can meet even the most complex demands in the electronics field, including the assembly of all types of components: BGA, FBGA, QFN, 0805, 0603, 0402, 0201…
\nThanks to Lean Manufacturing, continuous improvement and 5S, we offer the same level of quality to each of our customers.
\nBeing an electronics expert makes us an ideal partner for entering new markets.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>Advanced 3D SPI inspection<\/a><\/h2><\/div>We are convinced that 3D solder paste inspection (SPI) is a crucial technology in the electronics industry for precise solder control, detection of paste quality, offset, defects and data analysis to improve product quality, reliability and reduce production costs.
\nOur belief in the role led us to invest in a state-of-the-art 3D SPI machine from KohYoung.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
X-ray inspection for assemblies<\/a><\/h2><\/div>With the increasing complexity of electronic boards, X-ray inspection is now essential for checking the conformity of assembled boards. On boards with BGA or QFN components for the electronics industry, optical inspection is no longer sufficient for certain components. X-ray inspection therefore helps to eliminate the risk of producing defective boards and to optimise repair costs caused by \u2018cold\u2019 solder joints.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
We can meet even the most complex demands in the electronics field, including the assembly of all types of components: BGA, FBGA, QFN, 0805, 0603, 0402, 0201…
\nThanks to Lean Manufacturing, continuous improvement and 5S, we offer the same level of quality to each of our customers.
\nBeing an electronics expert makes us an ideal partner for entering new markets.<\/p>\n<\/div><\/div><\/div>
Advanced 3D SPI inspection<\/a><\/h2><\/div>We are convinced that 3D solder paste inspection (SPI) is a crucial technology in the electronics industry for precise solder control, detection of paste quality, offset, defects and data analysis to improve product quality, reliability and reduce production costs.
\nOur belief in the role led us to invest in a state-of-the-art 3D SPI machine from KohYoung.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
X-ray inspection for assemblies<\/a><\/h2><\/div>With the increasing complexity of electronic boards, X-ray inspection is now essential for checking the conformity of assembled boards. On boards with BGA or QFN components for the electronics industry, optical inspection is no longer sufficient for certain components. X-ray inspection therefore helps to eliminate the risk of producing defective boards and to optimise repair costs caused by \u2018cold\u2019 solder joints.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
We are convinced that 3D solder paste inspection (SPI) is a crucial technology in the electronics industry for precise solder control, detection of paste quality, offset, defects and data analysis to improve product quality, reliability and reduce production costs.
\nOur belief in the role led us to invest in a state-of-the-art 3D SPI machine from KohYoung.<\/p>\n<\/div><\/div><\/div><\/div><\/div>
X-ray inspection for assemblies<\/a><\/h2><\/div>With the increasing complexity of electronic boards, X-ray inspection is now essential for checking the conformity of assembled boards. On boards with BGA or QFN components for the electronics industry, optical inspection is no longer sufficient for certain components. X-ray inspection therefore helps to eliminate the risk of producing defective boards and to optimise repair costs caused by \u2018cold\u2019 solder joints.<\/p>\n<\/div><\/div><\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
With the increasing complexity of electronic boards, X-ray inspection is now essential for checking the conformity of assembled boards. On boards with BGA or QFN components for the electronics industry, optical inspection is no longer sufficient for certain components. X-ray inspection therefore helps to eliminate the risk of producing defective boards and to optimise repair costs caused by \u2018cold\u2019 solder joints.<\/p>\n<\/div><\/div><\/div>